About
Speed Technology Solutions Corp.
Regarding STS
With innovation and research and development as the core
Building high-performance semiconductor solutions
STS Innovation Technology was officially established in 2026 after three years of technology research and development and market preparation, with a paid-in capital of US$15 million. The company focuses on radio frequency (RF), high-speed communication and advanced semiconductor technologies, and is committed to providing high-performance and high-reliability chip design and system integration solutions.
The core team consists of senior professionals with an average of over 20 years of industry experience, covering areas such as integrated circuit (IC) design, semiconductor component applications, product development, and global market expansion, possessing complete technology integration and commercialization capabilities.
We adhere to the product strategy of "selling the present, developing the next generation, and positioning ourselves for future technologies," continuously driving technological iteration and product innovation to quickly respond to market changes and customer needs, and helping customers enhance their product competitiveness.
STS adopts a dual-engine development strategy, operating in parallel with its own product development and customized chip design services (ASIC Design Services). It provides a one-stop cooperation model from requirements analysis, chip design, verification, mass production to technical support, becoming a trusted semiconductor partner for global customers.

Speed Innovation Leads to the Future
Speed to Future
Vision & Mission
Company Vision: Through continuous research and development, optimization and improvement, and the establishment and layout of patented technologies, our company is committed to becoming a professional supplier of integrated circuits.
Core values: Proactive and innovative, is our company motto; we believe that only through a continuously self-upgrading product development strategy can we achieve our goal of becoming a world-class chip supplier.
Core Products
OUR SOLUTIONS
Silicon-based wafer chips
Our products have evolved from the development of basic microcontroller units (MCUs) and signal chain ICs to system-on-a-chip (SoC) and system-in-package (SiP) products, and further to artificial intelligence neural network processors (AI-NPUs) and derivative heterogeneous integrated system-in-package products.
Compound wafer chips
Our main products include high-voltage power components, optoelectronic components, microwave and radio frequency components. These products are widely used in automotive, industrial control and applications, power grid applications, robotics, medical equipment, and communications.
Background of Establishment
Early stage of research and development
2023
Automotive-grade SoC chip R&D and integration. NPU architecture planning.
Mid-stage of research and development
2024
Medical SoC chip R&D and integration. NPU computing power configuration.
Late stage of research and development
2025
NPU 20~25 TOPS design
Company established in the first quarter
2026
NPU MPW outsourcing (Generation 1). Simultaneously planning differentiated medical applications (Generation 2 design).
Company Development in the Second Quarter
2026
NPU has signed an MOU with medical applications. Simultaneously, it is undergoing evolution—a self-upgrading design for the NPU algorithm model (three generations of evolution).
Jon Gills
The team
How do we work
Why Us?
Through standardized development processes and cross-domain integration capabilities, we help clients accelerate product development and shorten time-to-market.









