About

Speed Technology Solutions Corp.

Regarding STS

With innovation and research and development as the core

Building high-performance semiconductor solutions

STS Innovation Technology was officially established in 2026 after three years of technology research and development and market preparation, with a paid-in capital of US$15 million. The company focuses on radio frequency (RF), high-speed communication and advanced semiconductor technologies, and is committed to providing high-performance and high-reliability chip design and system integration solutions.

The core team consists of senior professionals with an average of over 20 years of industry experience, covering areas such as integrated circuit (IC) design, semiconductor component applications, product development, and global market expansion, possessing complete technology integration and commercialization capabilities.

We adhere to the product strategy of "selling the present, developing the next generation, and positioning ourselves for future technologies," continuously driving technological iteration and product innovation to quickly respond to market changes and customer needs, and helping customers enhance their product competitiveness.

STS adopts a dual-engine development strategy, operating in parallel with its own product development and customized chip design services (ASIC Design Services). It provides a one-stop cooperation model from requirements analysis, chip design, verification, mass production to technical support, becoming a trusted semiconductor partner for global customers.

Speed Innovation Leads to the Future



Speed to Future 

Vision & Mission

Company Vision: Through continuous research and development, optimization and improvement, and the establishment and layout of patented technologies, our company is committed to becoming a professional supplier of integrated circuits.

Core values: Proactive and innovative, is our company motto; we believe that only through a continuously self-upgrading product development strategy can we achieve our goal of becoming a world-class chip supplier.

Core Products

OUR  SOLUTIONS

Silicon-based wafer chips

Our products have evolved from the development of basic microcontroller units (MCUs) and signal chain ICs to system-on-a-chip (SoC) and system-in-package (SiP) products, and further to artificial intelligence neural network processors (AI-NPUs) and derivative heterogeneous integrated system-in-package products.

Compound wafer chips

Our main products include high-voltage power components, optoelectronic components, microwave and radio frequency components. These products are widely used in automotive, industrial control and applications, power grid applications, robotics, medical equipment, and communications.

Background of Establishment

Early stage of research and development

2023

Automotive-grade SoC chip R&D and integration. NPU architecture planning.

Mid-stage of research and development

2024

Medical SoC chip R&D and integration. NPU computing power configuration.

Late stage of research and development

2025

NPU 20~25 TOPS design

Company established in the first quarter

2026

NPU MPW outsourcing (Generation 1). Simultaneously planning differentiated medical applications (Generation 2 design).

Company Development in the Second Quarter

2026

NPU has signed an MOU with medical applications. Simultaneously, it is undergoing evolution—a self-upgrading design for the NPU algorithm model (three generations of evolution).

The team

Expertise

Certifications & qualifications

Three generations of learning, consulting training, gaining skills and experience. We're a family business, and we treat you as family, too. We handle every request with the utmost care and professionalism. 

How do we work

Why Us?

Through standardized development processes and cross-domain integration capabilities, we help clients accelerate product development and shorten time-to-market.