How We Work

Through standardized development processes and cross-domain integration capabilities, we help clients accelerate product development and shorten time-to-market.

Service Process

From demand definition to chip mass production, we provide a complete one-stop IC design and manufacturing service to ensure that every project meets quality, performance and delivery requirements.

Step 1

Requirements Analysis

Confirm product requirements, technical specifications, and project objectives with clients, and complete feasibility assessments and development plans.

Deliverables

✓ Requirements Specification

✓ Feasibility analysis

✓ Project Planning

Step 2

IC Design

Complete chip architecture planning, RTL design, IP integration and functional development, and establish a complete design foundation.

Deliverables

✓ RTL Design

✓ IP Integration

✓ Design Review

Step 3

Functional verification

Perform functional simulation, coverage analysis, and debugging to ensure the design meets product specifications.

Deliverables

✓ Verification Report

✓ Coverage Report

✓ Debug Completion

Step 4

Solid design

Complete Floorplan, Placement, Routing, and Timing Optimization to generate the necessary data for Tape-out.

Deliverables

✓ Physical Layout

✓ Timing Closure

✓ GDSII

Step 5

wafer manufacturing

Collaborate with wafer foundries to complete chip manufacturing, process monitoring, and yield management.

Deliverables

✓ Qualified Wafer

✓ Manufacturing Report

Step 6

Packaging Testing

Complete packaging, electrical testing, functional verification, and reliability testing.

Deliverables

✓ Packaged IC

✓ Test Report

✓ Reliability Report

Step 7

Delivery support

Complete product delivery, provide technical support and follow-up maintenance services.

Deliverables

✓ Final Deliverables

✓ Technical Documentation

✓ Engineering Support

Precision

in Every Step.

Excellence

in Every Delivery.

What People Say About Us

Speed Technology Solutions Corp.

Speed to the Future

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