Compound Semiconductor-Based IC
Application areas
Our technologies and products are widely used in fields such as AI, high-speed transmission, smart communications, and smart IoT, helping customers create high-performance, high-reliability semiconductor solutions.
AI high-speed switch and optical transceiver module
It provides high-speed data transmission and low-latency interconnect solutions to meet the needs of AI data centers, high-performance computing (HPC), and cloud infrastructure.
AI 3D Vision Systems and Humanoid Robots
It integrates AI visual recognition, sensing and computing technologies to support smart manufacturing, autonomous robots and humanoid robot applications.
5G / 6G wireless communication
It provides high-speed, low-latency, and highly reliable wireless communication technology for use in next-generation communication equipment and network infrastructure.
AI drones and smart IoT
By combining AI computing, sensing technology, and smart connectivity, we can drive the development of drones, automated equipment, and AIoT applications.
Core Products
We focus on high-frequency, high-speed communication and system integration technologies, providing complete RF microwave integrated circuits and modular solutions.
Single-crystal microwave integrated circuits and multi-chip modules (MMIC | MCM)
By highly integrating active and passive components of radio frequency (RF) and microwave circuits into semiconductor wafers or multi-wafer modules, high-frequency, high-efficiency, and miniaturized solutions are provided, which are widely used in 5G communications, satellite communications, radar, aerospace defense and high-speed wireless transmission and other fields.
01
System-in-Package (SiP)
By integrating multiple chips with different functions (such as integrated circuits) and passive components into a single package module, a highly integrated microsystem design is achieved, providing higher efficiency and better power consumption performance in a limited space. It is widely used in smartphones, wearable devices, the Internet of Things and high-performance computing.
02
Hybrid Circuit Module
By highly integrating and packaging various components required by the system (such as chips, inductors, capacitors and antennas) into a single package module, a true system-in-package solution is achieved, which greatly improves the overall integration, reduces the size and optimizes the performance. It is suitable for applications such as high-frequency communications, mobile devices and multifunctional electronic systems.
03
Subsystem Design
We provide secondary system design services for growing gallium nitride (GaN) materials on silicon carbide (SiC) substrates, supporting the development of high-frequency, high-power radio frequency components for use in single-crystal microwave integrated circuits (MMICs) to meet the needs of advanced radio frequency applications such as high-performance wireless communication, radar, and defense.
04
Core design capabilities
We provide complete RF front-end and high-speed communication chip design capabilities, covering RF switches, power amplifiers, low-noise amplifiers and system module integration, to meet diverse high-frequency application needs.
RF Switch
(Radio frequency switch)
It provides high-speed signal switching between the antenna and the transmit/receive (TX/RX) path, with low insertion loss, high isolation and high reliability, which can effectively improve the performance of the RF front-end system.
GaAs ∣ SOI
Below 6GHz
Power Amplifier
(Power amplifier, PA)
It provides power amplification of the transmitter's RF signal, effectively transmitting the signal to the antenna, and features high output power, high efficiency, and low distortion, thereby improving the overall performance of the RF system.
GaAs ∣GaN
< 1~60GHz
Low Noise Amplifier
(Low-noise amplifier, LNA)
It provides receiver RF signal amplification, featuring low noise, high gain, and high sensitivity, effectively reducing the impact of noise on system performance while improving signal quality.
GaAs ∣CMOS
< 10GHz
Front-End Module
(Front-end module, FEM)
It integrates core functions such as RF switch, power amplifier (PA) and low noise amplifier (LNA) to provide a highly integrated RF front-end solution that balances high efficiency, low power consumption and miniaturized design.
GaAS SiP ∣ LTCC
< 10GHz
Audio System-in-Package
Audio SiP
(Audio System-in-Package)
Integrating core audio components such as AMP, DSP, and Codec, it provides a highly integrated audio module solution that balances high sound quality, low power consumption, and miniaturized design, thereby improving the overall performance of the audio system.
CMOS MEMS SiP
< 20KHz
Drone Transceiver Booster
(Drone transceiver wave booster)
Integrating transceivers and high-power amplifier modules, it provides a long-distance, highly reliable wireless communication solution, supporting video transmission up to 100km and data transmission up to 400km, while also offering high performance, low latency, and stable connectivity.
CMOS ∣GaN-on- SiC∣SDR
(Software Define Radio)
< 6GHz
Core technology platform
With microwave radio frequency (RF) and high-frequency communication technologies at its core, and integrating key technologies such as MMIC, MCM, SiP and GaN-on-SiC, it provides high-performance and high-reliability semiconductor solutions to meet the diverse application needs of next-generation communications, AI, high-speed computing and defense aerospace.
Technical Features
High-frequency, high-reliability single-crystal microwave integrated circuits are suitable for ultra-miniaturization and high-frequency applications.
Core advantages
Small size | High reliability | High consistency in mass production
Main applications
Radar, satellite communications, defense and aerospace
MMICMonolithic Microwave Integrated Circuit
MCMMulti-Chip Module
Technical Features
Integrating multiple chips with different functions into the same module improves system integration and design flexibility.
Core advantages
High integration | Rapid productization | Shortened development time
Main applications
High-speed computing, RF modules, automotive electronics, industrial control
SiPSystem-in-Package
Technical Features
By integrating chips, passive components, and antennas into a single package, high-density system integration can be achieved.
Core advantages
Ultra-miniaturization | High-performance integration | Support for heterogeneous integration
Main applications
Smartphones, wearable devices, wireless communications, Industry 4.0
GaN-on-SiCGallium Nitride on Silicon Carbide
Technical Features
A high-frequency, high-power, and high-efficiency material platform suitable for high-power radio frequency applications.
Core advantages
High power density | High efficiency | Excellent heat dissipation
Main applications
5G/6G base stations, radar, low Earth orbit (LEO) satellites, and fast charging for electric vehicles.
Let innovation,
Start with reliable technology.
LET’S BUILD THE FUTURE
We believe that every successful product stems from solid engineering capabilities and trustworthy partnerships. We look forward to working with you to create the next innovative achievement.
